A complete walk-through of the conversion from standard lead–tin to lead-free solder microelectronic assemblies for low-end and high-end applications, this timely reference analyzes the health risks associated with lead; estimates the environmental benefits of using lead-free substitutes in microelectronics; summarizes new regulations, legislation, and marketplace trends affecting the industry; and outlines changes and challenges on the materials, equipment, and process levels for manufacture of lead-free microelectronics.