RF/Microwave Hybrids: Basics, Materials and Processes
Richard Brown
RF/Microwave Hybrids is directed to acquaint technical managers, engineers and technicians, either with experience, or just entering the field, with the capabilities and limitations of the materials and processes used for fabricating high frequency circuits. It is essentially introductory in nature. Where possible, equations have been kept simple and to a minimum. This text begins with an introduction to hybrid technology and basic high frequency principles. Following these, the major forms of transmission waveguide are discussed, and then current flow and loss considerations. Substrates, thick and thin film deposition, polymers, artwork, masks, photolithography, subtractive, additive and semi-additive methods, electro- and electroless plating and etching are covered. Passive and transmission line components are then treated within the confines of process requirements. With this background established, the text is directed toward the effects of processing and materials on passive and transmission line-based components. Packaging is discussed with emphasis on inductance considerations.
