This edition reflects the continued evolution of semiconductor technology, describing the equipment used in manufacturing for deposition and etching, such as electrochemical deposition equipment used for plating copper. It emphasizes the measurement of mechanical and thermal properties as well as the use of EELS, energy filtering TEM, and atomic force microscopy. Expert contributors explore recently reported developments in thin film liners and barriers, choices for low-dielectric insulators, address major issues in processing, and cover deposition and etching of metallic films with a focus on electroplated copper. The book also examines the reliability of thin metallic and insulating films and features expanded discussions on copper reliability. Publications and patents are extensively cited throughout the book.

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